Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM

hot sale Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM only $ 8.500. with 1 year warranty.

Axcelis Eaton 8250 Ion Implanter Main Body Interface Module,

Currently 150 MM

• System Classification: Serial processing, medium-current ion implanter. 
• Wafer Size Capability: Optimized for 150mm (6-inch) wafer fabrication, though the baseline 8250 platform inherently supports a physical range of 100mm to 200mm via modular hardware changes. 
• Module Function: Bridges the main system body to front-end wafer automation  handling vacuum load-lock handoffs and communication protocols between processing and loading logic. 

• Beam Energy Range: 10 keV to 700 keV.
• Maximum Ion Beam Current: Up to 150 mA maximum capability.
• Scanning Mechanism: 3-axis hybrid scanning system featuring an electrostatic scan angle correction lens.
• Beam Parallelism: Better than ±0.2 degrees at the wafer plane.
• Implant Versatility: Supports both N-type and P-type dopant species.
• Process Alignment: Features a 45° Tilt axis and 360° Twist axis for variable-angle, in-situ quad implantation. 

• Dosimetry & Monitoring: Utilizes real-time patented dose control and single-dimension real-time beam profiling at the wafer plane.
• Clamping System: Integrated electrostatic wafer clamping mechanism to maximize cooling and position stability.
• Automation Software: Template-based format programming, customizable I/O process parameters, and integrated diagnostic safety interlocks.