CEE Apogee Bake Plate (Wafer Sizes up to 200mm round or 8 x 8 square)

For sale CEE Apogee Bake Plate (Wafer Sizes up to 200mm round or 8 x 8 square) only $ 5.300. With 1 year warranty. The CEE Apogee Bake Plate is a high-quality baking accessory designed for semiconductor and PCB manufacturing equipment. Made by CEE Brewer Science in the United States, this unit is capable of baking wafers up to 200mm round or 8″ x 8″ square. This bake plate is a reliable and efficient tool for precise and consistent baking in the semiconductor industry. 110V 15A Single Phase

• Maximum Size: Up to 200 mm round wafers or 8″ × 8″ square substrates.
• Minimum Size: 2-inch round wafers (smaller pieces are supported with limited electronic functionality). 

• Temperature Range: Ambient to 300°C (with an optional factory upgrade to 400°C).
• Temperature Uniformity: ±0.3% across the entire active working area.
• Temperature Resolution: 0.1°C.
• Bake Methods: Electronic execution of Contact, Vacuum, and Proximity bakes.
• Substrate Auto-Sizing: Automated vacuum/proximity sizing handles 3-inch, 100 mm, 150 mm, and 200 mm configurations. 

• Interface: 7-inch full-color alphanumeric touchscreen GUI powered by DataStream™ technology.
• Recipe Capacity: Unlimited process recipes and unlimited steps per recipe.
• Step Time Resolution: 0.1 seconds.
• Smart Pin™ Height Control: Electronic lift pins feature a range of 0–19 mm with 0.1 mm resolution. 

• Physical Dimensions: 13.25″ W × 21.0″ D × 17.25″ H (337 mm × 533 mm × 439 mm).
• Machine Weight: 65 lbs (29.5 kg).
• Electrical Requirements: 110V AC, 15A, Single Phase.
• Connectivity: Integrated USB and Ethernet ports for remote network access and real-time data logging