Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM

Name: Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM
SKU: OME0189
Availability: InStock

Condition : Used

$8,500.00

hot sale Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM only $ 8.500. with 1 year warranty.

Axcelis Eaton 8250 Ion Implanter Main Body Interface Module,

Currently 150 MM

Axcelis Eaton 8250 Ion Implanter Main Body Interface Module, 150MM Specifications

System Classification: Serial processing, medium-current ion implanter.
Wafer Size Capability: Optimized for 150mm (6-inch) wafer fabrication, though the baseline 8250 platform inherently supports a physical range of 100mm to 200mm via modular hardware changes.
Module Function: Bridges the main system body to front-end wafer automation handling vacuum load-lock handoffs and communication protocols between processing and loading logic.

Baseline Platform Operational Limits (NV-8250)

The interface module operates seamlessly within the broader parameters of the Eaton Nova / Axcelis 8250 system ecosystem:

Beam Energy Range: 10 keV to 700 keV.
Maximum Ion Beam Current: Up to 150 mA maximum capability.
Scanning Mechanism: 3-axis hybrid scanning system featuring an electrostatic scan angle correction lens.
Beam Parallelism: Better than ±0.2 degrees at the wafer plane.
Implant Versatility: Supports both N-type and P-type dopant species.
Process Alignment: Features a 45° Tilt axis and 360° Twist axis for variable-angle, in-situ quad implantation.

Integrated Control & Safety Systems

Dosimetry & Monitoring: Utilizes real-time patented dose control and single-dimension real-time beam profiling at the wafer plane.
Clamping System: Integrated electrostatic wafer clamping mechanism to maximize cooling and position stability.
Automation Software: Template-based format programming, customizable I/O process parameters, and integrated diagnostic safety interlocks.